Vignesh J

I have wide experience in customer handling for design verification (DRC & DFM) .Control impedance stackup design pre and prost design stages. Traveler or route card preparation.Process flow preparation .Quote preparation. Specialized in polar speed stack for stackup preparation for various special PCB's like Metal core PCB , Flex PCB and Rigid flex PCB , HDI PCB with stacked and staggered via's. Technical interaction with customer to make the design feasible during the design stage .

Junior supervisor CAM(July 2009 to July2011)

Performing DRC to check the manufacturability of the PCB’s .

Carryout DFM action to fulfil the customer and internal production requirement.

Ensuring that the minimum requirement of each stage such as drilling, Routing, Solder mask and silk screen etc.. maintained as per the internal specific requirements without affecting customer requirements.

Performing the penalization with best utilization to meet the customer order qty requirement, in order to ensure that the material utilization as well as QTY requirements including the rejection factor details shared .

Incorporation and verification of coupon placements with reference to the grade of the PCB

and application requirement basically to check the representation of the gerber / input . Using these test coupons in house process verification and product confirmation as well as lot disposition will be carried out based on the test coupons.

Providing Etch compensation with reference to the copper thickness requirement and adding the tear drops (if required) to meet the connectivity as well as customer required trace width and spacing have been maintained to meet the design requirement / specification requirement shared along with the input package.

Preparation of photo plotted films using LASER photo plotters for image transfer, for inner layer, outer layer and solder mask , silk screen etc.

Preparation of documents for each job, basically documents required for each process like CNC drilling , Inner layer imaging and developing , Etching with the necessary documents includes drawing.

Preparation of programs for Drilling and routing.

Preparation of net list comparison report with reference to the Gerber or net list

Pre-egg Roles (2014 Aug to 2017 and Dec 2017 to June 2023)

Sales support activities:

Interaction with RM supplier to get the details of technical aspect and costing

requirement based on the quantity requirements for the project .

Closely interacting with SCM team and finance team to fulfil the costing

requirements .

Interacting with customers on target pricing requirements of the parts indicated in

project.

Preparation of costing sheet requirements of each part number with detailed

analysis of the parts with material and other supporting details.

Upon receipt of the pricing sheet from internal team sending quote to customer

with payment terms defined.

Played vital role in forming the sales support team for the internal sales team.

Training of internal sales and sales support team on the various requirements

indicated by customer on regular basis.

Follow up with customer on the status of quote / Bid submitted.

Conversation of quote to PO from customer / SCM of customer.

Monitoring of order provided by customer to get the payment updates.

Interaction with accounts team on pending invoice collection and follow-up with

customer on the payment.

Visiting customers to discuss on the new project discussion and payment follow

up.Technical support activities:

Technical interaction with customer for understanding the technical requirements

of the product and providing the suggestion to the designer to make the design with

manufacturing feasibility.

Interacting with customers for specific technical quires / clarification to get the

resolutions.

Conducting technical feasibility review and preparing the feasibility report which

will be done at 2 stages during the RFQ stage as well as against PO based on order

confirmation from customer.

Preparation of technical Feasibility review report with process flow skeleton.

Verification of input package which including the Gerber verification using

INTEGR8TOR as well as INCAM pro (Basically to understand the requirement

of the design) and fab note / details verification.

Preparation of CONTROL IMPEDANCE STACKUP / Non impedance using POLAR

SPEED STACK.

PCB material Library creation in polar speed stack for New RM.

PCB material Library Development and enhancement of polar speed-stack.

Simulation using SI8000 to understand the process variation (process verification).

Designing stack-up for RIGID PCB’s, RIGD FLEX PCB’s and FLEXIBLE PCB’s as

well as HYBRID PCB’s and HDI PCB’s & BLIND VIA PCB’s , BURIED VIA PCB’s ,

Metal core PCB’s .

Stackup designing will be done at 2 stages first one is prior to designing.

Stackup designing upon receipt of order (based on fab drawings and input package) to

meet the PCB thickness as well as di-electric thickness requirements.

Stackup development during the costing stage /RFQ stage with full details of the specific

project / part#

100% independent team verification for job flow preparation and feasibility studies.

Allocation of internal code for each part# that goes to process.

Filling technical review checklist, converting customer data into internal format.

preparation of TQ sheet to get the feedback and concurrence from customers.

Generation of impedance stackup and control impedance test coupons.

Folder preparation with all details and loading the input package to CAM station.

Understanding the each product requirement and verification of the traveler (process

requirements) to comply with the process and product requirements.Other Activities involved.

Handled 38-layer PCB with specific and special requirement.

Full-fledged support for development of Technical Details Preparation for RFQ / costing.

Handled Rigid FLEX qualification PCB for space grade requirement.

Hands-off experience in operating of CO2 LASER drilling Machine and process setting for

various kinds of material.

Special PCB developed with LASER drilling for RIGDFLEX PCB.

Development of Rigid FLEX PCB with various pre-preg’s.

Interaction With in-house team (Production and Process) for the various new products

development based on the customers’ new requirements.

Clients visit for the technical interaction and resolving the issue observed on their designs and making common understanding between each other.

Handled all the QUALIFICATION panels of in-house and customer requirements.

Involved on getting qualification of Rigid PCB with 24layer Space grade and 10-layer Rigid

flex qualification.

College : JKKN COLLEGE OF ENGG&TECH,KOMARAPALAYAM.
Trade : B.E(Bachelor Of Engineering , Electrical and Electronics Engineering).
College : THIAGARAJAR POLYTECHNIC COLLEGE,SALEM.
Trade : (DEEE) DIPLOMA IN Electrical and Electronics Engineering.